Kuldeep Agarwal was born in Delhi, India in 1979. He pursued Manufacturing Engineering and graduated from Indian Institute of Technology, Kharagpur in 2001. After his Bachelors he joined Manufacturing Research Group under Dr. Rajiv Shivpuri at Ohio State University as a Master’s student. During this time he worked on the development of forging dies for aluminum forgings. He successfully designed and manufactured an additive manufactured die for short run aluminum forgings for a defense manufacturer. He graduated with his Masters in Industrial and Systems Engineering in 2003.
After his Masters he returned to his hometown Delhi. He expanded on his family business and started Injection Mold manufacturing in Delhi. He was the Director of Technology for 4 years and worked on design, development and manufacturing of Plastic Injection molds.
In 2007, he retuned to Ohio State to pursue his Ph.D. He worked on several industrial projects with metal forming manufacturers. The projects included defect identification in bar rolling using statistical tools, modeling of zirconium extrusion and prediction of properties in sheet rolling. He graduated with a Ph.D in 2011 in Integrated Systems Engineering along with a Masters in Applied Statistics in 2010.
He started as an Assistant Professor at MSU Mankato in 2012. He has been very active in various societies and research activities. He was awarded Society of Manufacturing Engineers (SME) Outstanding Young Manufacturing Engineer Award in 2015. He is also a counsellor in Engineering Division of the Council of Undergraduate Research (CUR).
Dr. Agarwal has worked with several industries in the last 10 year
s on various projects and as a consultant. Several of his students have presented at prestigious national and international conferences. His student, Michael Doyle, presented his research at the White House. He has published more than 30 articles in
journals, conferences and books. He has helped establish the Minnesota Center for Additive Manufacturing (MnCAM) with Dr. Winston Sealy.